Your boards are assembled on state-of-the-art, high-precision and highly flexible pick-and-place machines.
The annual maintenance of our systems guarantees a constant level of accuracy across the entire component spectrum from the chip size 0201 to the BGAs with an edge length of 50 x 50 mm. The assembly rate is max. ca 35,000 units per hour. It should also be noted that the entire spectrum of state-of-the-art components can be assembled, e.g. BGAs, µBGAs, CSPs, QFNs or QFPs
Wave soldering
For the soldering that takes place after the THT assembly two wave-soldering systems from Kirsten Soldering AG. are used. The patented jet wave of the soldering systems guarantees the flawless and gentle processing of subassemblies with a maximum width of 400 mm.
The negative pressure generated by the flow of the solder is exerted in a gentle but constant manner on the components on the top side of the PCBs. Thus they remain in position and do not rise up, as is usually the case with other systems using Wörthmann or double wave. Perfect results with special masks are also achieved with selective soldering processes – both with leaded and unleaded solders.